PHIL SPLETTER
Electronic Packaging and Manufacturing Consultant
I have over 30 years of electronic packaging design, analysis, technology development and manufacturing experience. My main interests are performing competitive analysis, packaging technology selection and development. I have experience helping a variety of customers perform the following tasks:
- Competitive analysis
- Electronic component packaging technology selection
- Manufacturing equipment and process technology selection
- Prototype fabrication and evaluation
- Cost reduction
- Size reduction
- Performance improvement
During my career, I have designed and manufactured products ranging from micro-miniature secure communication systems to avionic systems for the Space Shuttle and the Hubble telescope. I have developed laser processes for bonding leads to ICs and fluxless solder reflow to substrates. In addition, I have reverse engineered products to analyze the technologies and processes in the product. I have been an individual contributor, project engineer and manager including fiscal responsibility for a multi-year project with a $1 million annual budget, and had functional management responsibility for a group of approximately 20 people in an assembly lab, mechanical design group and a machine shop. I have worked in specific product design and development as well as research and development environments for both system level and semiconductor packaging. For the past five years, I have worked as an independent consultant. During this time, I have helped two major OEMs identify cost reduction opportunities for a high volume consumer product. For other clients, I have researched and reported on multi-chip packaging technology and provided competitive analysis for microelectronic packaging equipment and processes in consumer electronic products.
I began my career at Harris Corporation Electronic Systems Sector after graduation from the University of Central Florida in 1976 with a BS in Mechanical Engineering. At Harris, I performed design and development of microelectronic packaging technology for miniature secure communications and avionic systems. In 1984, Harris assigned me to help start MCC, the first pre-competitive co-operative research consortium in the United States. There, I held several positions including leadership of a project to develop laser technology for TAB inner and outer lead bonding. I also managed the assembly and mechanical design functions and performed reverse engineering analysis of consumer electronics and flat panel displays. During 1995, I joined Savantage, a MCC spin-off that developed and marketed a software package that performed cost/performance tradeoffs for different material and packaging technologies. In 1997 Savantage was sold and I became an independent consultant in the electronic packaging and manufacturing field.
During my career, I have been issued six U.S. patents and have authored numerous publications relating to electronic packaging and manufacturing technology. I am a member of IEEE and IMAPS.