P. Spletter, B. Boan and C. Adkins, \u201cMicroscopic Corrosion as an Inhibitor in Hermetic Solder Sealing\u201d, Proceedings of National Association of Corrosion Engineers International Forum, New Orleans, LA, April 1984.<\/p>\n\n\n\n
B. Boan, P. Spletter and C. Adkins, \u201cHermetic Solder Sealing of Large Cavities\u201d, Proceedings of American Society for Metals 2nd Electronic Materials and Processes Conference, Bloomington, MN, August 1984, pp. 89-93.<\/p>\n\n\n\n
P. J. Spletter, \u201cA Multi-Chip Package with Die Mounted on Two Sides of a Substrate\u201d, Digest of Papers of 1984 Government Microcircuit Applications Conference, Las Vegas, NV, November 1984.<\/p>\n\n\n\n
P. Spletter, C. Galanakis, N. Luijtjes, C.MacKay, Y. Jee and O. Woodard, \u201cTape Automated Bonding Inner Lead Bonding with a Laser for High Performance Applications\u201d, Journal of Vacuum Science and Technology B, Vol. 7, No. 6, November\/December 1989, pp. 1967-1971.<\/p>\n\n\n\n
P. Spletter, C. MacKay, Y. Jee, C. Galanakis, N. Luijtjes, O. Woodard, \u201cFlexible High Performance TAB Inner Lead Bonding with a Laser\u201d, Proceedings of the Ninth Annual International Electronics Packaging Conference, San Diego, CA, September, 1989. Also published in Journal of the International Society for Hybrid Microelectronics \u2013 Europe, May 1990, pp. 12-15.<\/p>\n\n\n\n
P. Spletter and R. Crowley, \u201cA laser Based System for Tape Automated Bonding to Integrated Circuits\u201d, Proceedings of the 40th Electronic Components and Technology Conference, Las Vegas, NV, May 1990, pp.757-761.<\/p>\n\n\n\n
P. Spletter, \u201cGold-to-Gold TAB Inner Lead Bonding with a Laser\u201d, Proceedings of the Fourth International Tape Automated Bonding (TAB) Symposium, San Jose, CA, February, 1992, pp. 58-71. Also published in IEEE Transactions on Components, Packaging and Manufacturing Technology Part B: Advanced Packaging, November 1994, pp. 554-558.<\/p>\n\n\n\n
P. Spletter, P. Mehrotra and S. Lee, \u201cA Comparison of High Frequency Electrical Performance of Bi-Polar Junction Transistors Packaged by Three Different Chip Interconnect Approaches\u201d, Proceedings of the 1994 International Electronics Packaging Conference, Atlanta, GA, September 1994, pp. 826-834.<\/p>\n\n\n\n
P. Spletter, \u201cIntelligent Chip Interconnection Technology Selection\u201d, Proceedings of the 1995 International Electronics Packaging Conference, San Diego, CA, September 1995, pp. 367-374.<\/p>\n\n\n\n
P. Sandborn and P. Spletter, \u201cA Comparison of Routing Estimations Methods for Microelectronic Modules\u201d, Proceedings of the 1996 International Electronics Packaging Conference, Austin, TX, September 1996, pp. 651-663.<\/p>\n\n\n\n
P. Spletter and C. Reber, \u201cTo KGD or Not to KGD? That is the Question!\u201d, Proceedings of the 6th Annual Conference and Exhibition on Multichip Modules, Denver, CO, April 1997.<\/p>\n\n\n\n
Integrated Systems Article<\/p>\n\n\n\n
KGD Workshop<\/p>\n\n\n\n
E. Vardaman and P. Spletter, \u201cHigh Density Packaging for Portable Products\u201d Proceedings of the 35th IMAPS Nordic Annual Conference, Stockholm, Sweden, September 1998. IMAPS.<\/p>\n\n\n\n
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P. Spletter, B. Boan and C. Adkins, \u201cMicroscopic Corrosion as an Inhibitor in Hermetic Solder Sealing\u201d, Proceedings of National Association of Corrosion Engineers International Forum, New Orleans, LA, April 1984. B. Boan, P. Spletter and C. Adkins, \u201cHermetic Solder Sealing of Large Cavities\u201d, Proceedings of American Society for Metals 2nd Electronic Materials and Processes Conference, […]<\/p>\n","protected":false},"author":1,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"footnotes":""},"class_list":["post-24","page","type-page","status-publish","hentry"],"_links":{"self":[{"href":"https:\/\/philspletter.com\/index.php?rest_route=\/wp\/v2\/pages\/24","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/philspletter.com\/index.php?rest_route=\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/philspletter.com\/index.php?rest_route=\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/philspletter.com\/index.php?rest_route=\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/philspletter.com\/index.php?rest_route=%2Fwp%2Fv2%2Fcomments&post=24"}],"version-history":[{"count":1,"href":"https:\/\/philspletter.com\/index.php?rest_route=\/wp\/v2\/pages\/24\/revisions"}],"predecessor-version":[{"id":25,"href":"https:\/\/philspletter.com\/index.php?rest_route=\/wp\/v2\/pages\/24\/revisions\/25"}],"wp:attachment":[{"href":"https:\/\/philspletter.com\/index.php?rest_route=%2Fwp%2Fv2%2Fmedia&parent=24"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}