Philip J. Spletter
730 Poinsetta Drive
Satellite Beach, FL 32937<\/p>\n\n\n\n
SUMMARY: Over 30 years experience in electronic packaging development, design and manufacturing of microelectronic systems, boards, chips and modules. Product knowledge ranges from consumer electronics to military and aerospace. Extensive experience with device and system level packaging technologies including wire bonding, encapsulation, flip-chip, SMT, TAB and optoelectronic for digital and analog applications. Knowledgeable about flat panel displays, PCBs, thin film, ceramics and other interconnect structures. Successful project leader and proven innovator. Comfortable working individually or in a team environment. Employment history follows:<\/p>\n\n\n\n
PROFESSIONAL EXPERIENCE<\/strong><\/p>\n\n\n\n Independent Consultant<\/strong> \u2013 Perform specific projects for clients 11\/97 \u2013 present<\/p>\n\n\n\n Portelligent, Inc<\/strong> (www.portelligent.com) Thinfilm Electronics<\/strong> (www.thinfilm.se) TechSearch International, Inc<\/strong> (www.techsearchinc.com) Austin Ventures, Inc<\/strong> NuThena Systems, Inc<\/strong> Savantage, Inc. Austin, TX<\/strong> \u2013 Sr. Application Consultant 4\/95 \u2013 5\/98 MCC Austin, TX<\/strong> \u2013 Sr. Member of Technical Staff 10\/84 \u2013 4\/95 Harris Corp. Melbourne, FL<\/strong> \u2013 Staff Engineer, Mechanical 8\/76 \u2013 10\/84 BSE, Mechanical Engineering, University of Central Florida. Six US patents. Numerous publications. Member of IMAPS.<\/p>\n","protected":false},"excerpt":{"rendered":" Philip J. Spletter730 Poinsetta DriveSatellite Beach, FL 32937 SUMMARY: Over 30 years experience in electronic packaging development, design and manufacturing of microelectronic systems, boards, chips and modules. Product knowledge ranges from consumer electronics to military and aerospace. Extensive experience with device and system level packaging technologies including wire bonding, encapsulation, flip-chip, SMT, TAB and optoelectronic […]<\/p>\n","protected":false},"author":1,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"footnotes":""},"class_list":["post-20","page","type-page","status-publish","hentry"],"_links":{"self":[{"href":"https:\/\/philspletter.com\/index.php?rest_route=\/wp\/v2\/pages\/20","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/philspletter.com\/index.php?rest_route=\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/philspletter.com\/index.php?rest_route=\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/philspletter.com\/index.php?rest_route=\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/philspletter.com\/index.php?rest_route=%2Fwp%2Fv2%2Fcomments&post=20"}],"version-history":[{"count":2,"href":"https:\/\/philspletter.com\/index.php?rest_route=\/wp\/v2\/pages\/20\/revisions"}],"predecessor-version":[{"id":39,"href":"https:\/\/philspletter.com\/index.php?rest_route=\/wp\/v2\/pages\/20\/revisions\/39"}],"wp:attachment":[{"href":"https:\/\/philspletter.com\/index.php?rest_route=%2Fwp%2Fv2%2Fmedia&parent=20"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}
Performed complete teardown of mobile phones for competitive analysis. Determined the chip, module, substrate, housing fabrication and assembly technologies to estimate the recurring cost-of-goods-sold.<\/p>\n\n\n\n
Responsible for entire project to develop MQFP plastic leaded chip carrier with alternative materials and processes to provide a standard package for a chip with low temperature packaging requirements. Located low temperature curing materials and a stencil printing process that was modified to print packages on a copper lead frame as an alternative to conventional transfer molding. Also managed a project to build a 2-D model for heat transfer numerical simulation.<\/p>\n\n\n\n
\u2013 Led study to determine market size and technical requirements for new wire bonding equipment
\u2013 Researched and wrote chapter on barriers to MCM technology for multi-client study
\u2013 Performed comparative study of ovens for solder reflow and polymer curing
\u2013 Assisted with cost and technical evaluation of an interconnect fabrication process for a potential purchaser of the technology
\u2013 Investigated of capabilities of thermosonic gold ball wire bonders with large bonding area
\u2013 Researched and wrote chapter on worldwide status of lead-free soldering for a multi-client study<\/p>\n\n\n\n
\u2013 Evaluated alternative plastic molding material and process for electronic encapsulation during due diligence<\/p>\n\n\n\n
\u2013 Determine most cost effective electronic packaging and manufacturing for a set-top box
\u2013 Constructed manufacturing cost models for a high-volume manufacturing line
\u2013 Provide application support to users of SavanSys software<\/p>\n\n\n\n
A spin out of MCC, supplier of SavanSys DTC and DFM software for the electronics industry.
\u2013 Performed specific cost reduction and alternate technology studies for customers
\u2013 Taught training classes to new SavanSys users
\u2013 Started and led SavanSys users group
\u2013 Instrumental in business development
\u2013 Contributed to development of additional capabilities of SavanSys software
\u2013 Company sold to NuThena Systems, Inc<\/p>\n\n\n\n
An industry and government funded research and development consortium.
\u2013 Started and led $3M three year project to develop laser based bonding techniques for microelectronic circuits and assemblies. Technology was licensed to a commercial vendor.
\u2013 Led project to investigate flat panel display technology, especially driver chip connection
\u2013 Managed assembly lab, mechanical design group and machine shop (20 people, $3M equip)
\u2013 Performed reverse engineering of consumer electronic products
\u2013 Assigned to MCC by Harris to help start MCC<\/p>\n\n\n\n
\u2013 Responsible for projects to build miniaturized electronic, opto-electronic and avionic systems
\u2013 Contributed significantly to proposals, white papers and R&D projects
\u2013 Group leader for Advanced Technology group<\/p>\n\n\n\n