Electronic Packaging and Manufacturing Consultant<\/p>\n\n\n\n
I have over 30 years of electronic packaging design, analysis, technology development and manufacturing experience. My main interests are performing competitive analysis, packaging technology selection and development. I have experience helping a variety of customers perform the following tasks:<\/p>\n\n\n\n
During my career, I have designed and manufactured products ranging from micro-miniature secure communication systems to avionic systems for the Space Shuttle and the Hubble telescope. I have developed laser processes for bonding leads to ICs and fluxless solder reflow to substrates. In addition, I have reverse engineered products to analyze the technologies and processes in the product. I have been an individual contributor, project engineer and manager including fiscal responsibility for a multi-year project with a $1 million annual budget, and had functional management responsibility for a group of approximately 20 people in an assembly lab, mechanical design group and a machine shop. I have worked in specific product design and development as well as research and development environments for both system level and semiconductor packaging. For the past five years, I have worked as an independent consultant. During this time, I have helped two major OEMs identify cost reduction opportunities for a high volume consumer product. For other clients, I have researched and reported on multi-chip packaging technology and provided competitive analysis for microelectronic packaging equipment and processes in consumer electronic products.<\/p>\n\n\n\n
I began my career at Harris Corporation Electronic Systems Sector after graduation from the University of Central Florida in 1976 with a BS in Mechanical Engineering. At Harris, I performed design and development of microelectronic packaging technology for miniature secure communications and avionic systems. In 1984, Harris assigned me to help start MCC, the first pre-competitive co-operative research consortium in the United States. There, I held several positions including leadership of a project to develop laser technology for TAB inner and outer lead bonding. I also managed the assembly and mechanical design functions and performed reverse engineering analysis of consumer electronics and flat panel displays. During 1995, I joined Savantage, a MCC spin-off that developed and marketed a software package that performed cost\/performance tradeoffs for different material and packaging technologies. In 1997 Savantage was sold and I became an independent consultant in the electronic packaging and manufacturing field.<\/p>\n\n\n\n
During my career, I have been issued six U.S. patents and have authored numerous publications relating to electronic packaging and manufacturing technology. I am a member of IEEE and IMAPS.<\/p>\n\n\n\n
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PHIL SPLETTER Electronic Packaging and Manufacturing Consultant I have over 30 years of electronic packaging design, analysis, technology development and manufacturing experience. My main interests are performing competitive analysis, packaging technology selection and development. I have experience helping a variety of customers perform the following tasks: During my career, I have designed and manufactured products […]<\/p>\n","protected":false},"author":1,"featured_media":14,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"footnotes":""},"class_list":["post-16","page","type-page","status-publish","has-post-thumbnail","hentry"],"_links":{"self":[{"href":"https:\/\/philspletter.com\/index.php?rest_route=\/wp\/v2\/pages\/16","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/philspletter.com\/index.php?rest_route=\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/philspletter.com\/index.php?rest_route=\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/philspletter.com\/index.php?rest_route=\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/philspletter.com\/index.php?rest_route=%2Fwp%2Fv2%2Fcomments&post=16"}],"version-history":[{"count":1,"href":"https:\/\/philspletter.com\/index.php?rest_route=\/wp\/v2\/pages\/16\/revisions"}],"predecessor-version":[{"id":17,"href":"https:\/\/philspletter.com\/index.php?rest_route=\/wp\/v2\/pages\/16\/revisions\/17"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/philspletter.com\/index.php?rest_route=\/wp\/v2\/media\/14"}],"wp:attachment":[{"href":"https:\/\/philspletter.com\/index.php?rest_route=%2Fwp%2Fv2%2Fmedia&parent=16"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}