Phillip J. Spletter
730 Poinsetta Drive
Satellite Beach, FL 32937
321 514-2525 (Mobile)
PSpletter@cfl.rr.com
SUMMARY: Over 30 years experience in electronic packaging development, design and manufacturing of microelectronic systems, boards, chips and modules. Product knowledge ranges from consumer electronics to military and aerospace. Extensive experience with device and system level packaging technologies including wire bonding, encapsulation, flip-chip, SMT, TAB and optoelectronic for digital and analog applications. Knowledgeable about flat panel displays, PCBs, thin film, ceramics and other interconnect structures. Successful project leader and proven innovator. Comfortable working individually or in a team environment. Employment history follows:
PROFESSIONAL EXPERIENCE
Independent Consultant – Perform specific projects for clients 11/97 – present
Portelligent, Inc (www.portelligent.com)
Performed complete teardown of mobile phones for competitive analysis. Determined the chip, module, substrate, housing fabrication and assembly technologies to estimate the recurring cost-of-goods-sold.
Thinfilm Electronics (www.thinfilm.se)
Responsible for entire project to develop MQFP plastic leaded chip carrier with alternative materials and processes to provide a standard package for a chip with low temperature packaging requirements. Located low temperature curing materials and a stencil printing process that was modified to print packages on a copper lead frame as an alternative to conventional transfer molding. Also managed a project to build a 2-D model for heat transfer numerical simulation.
TechSearch International, Inc (www.techsearchinc.com)
– Led study to determine market size and technical requirements for new wire bonding equipment
– Researched and wrote chapter on barriers to MCM technology for multi-client study
– Performed comparative study of ovens for solder reflow and polymer curing
– Assisted with cost and technical evaluation of an interconnect fabrication process for a potential purchaser of the technology
– Investigated of capabilities of thermosonic gold ball wire bonders with large bonding area
– Researched and wrote chapter on worldwide status of lead-free soldering for a multi-client study
Austin Ventures, Inc
– Evaluated alternative plastic molding material and process for electronic encapsulation during due diligence
NuThena Systems, Inc
– Determine most cost effective electronic packaging and manufacturing for a set-top box
– Constructed manufacturing cost models for a high-volume manufacturing line
– Provide application support to users of SavanSys software
Savantage, Inc. Austin, TX – Sr. Application Consultant 4/95 – 5/98
A spin out of MCC, supplier of SavanSys DTC and DFM software for the electronics industry.
– Performed specific cost reduction and alternate technology studies for customers
– Taught training classes to new SavanSys users
– Started and led SavanSys users group
– Instrumental in business development
– Contributed to development of additional capabilities of SavanSys software
– Company sold to NuThena Systems, Inc
MCC Austin, TX – Sr. Member of Technical Staff 10/84 – 4/95
An industry and government funded research and development consortium.
– Started and led $3M three year project to develop laser based bonding techniques for microelectronic circuits and assemblies. Technology was licensed to a commercial vendor.
– Led project to investigate flat panel display technology, especially driver chip connection
– Managed assembly lab, mechanical design group and machine shop (20 people, $3M equip)
– Performed reverse engineering of consumer electronic products
– Assigned to MCC by Harris to help start MCC
Harris Corp. Melbourne, FL – Staff Engineer, Mechanical 8/76 – 10/84
– Responsible for projects to build miniaturized electronic, opto-electronic and avionic systems
– Contributed significantly to proposals, white papers and R&D projects
– Group leader for Advanced Technology group
BSE, Mechanical Engineering, University of Central Florida. Six US patents. Numerous publications. Member of IMAPS.